| Publication Type |
Journal Article |
| Title |
Electrodeposition and characterization of nickel-copper metallic foams for application as electrodes for supercapacitors |
| Authors |
S Eugénio T. M. Silva Maria J. Carmezim R.G. Duarte Maria F. Montemor |
| Groups |
CSSE |
| Journal |
JOURNAL OF APPLIED ELECTROCHEMISTRY |
| Year |
2014 |
| Month |
April |
| Volume |
44 |
| Number |
4 |
| Pages |
455-465 |
| Abstract |
Nickel-copper metallic foams were electrodeposited from an acidic electrolyte, using hydrogen bubble evolution as a dynamic template. Their morphology and chemical composition was studied by scanning electron microscopy and related to the deposition parameters (applied current density and deposition time). For high currents densities (above 1 A cm(-2)) the nickel-copper deposits have a three-dimensional foam-like morphology with randomly distributed nearly-circular pores whose walls present an open dendritic structure. The nickel-copper foams are crystalline and composed of pure nickel and a copper-rich phase containing nickel in solid solution. The electrochemical behaviour of the material was studied by cyclic voltammetry and chronopotentiometry (charge-discharge curves) aiming at its application as a positive electrode for supercapacitors. Cyclic voltammograms showed that the Ni-Cu foams have a pseudocapacitive behaviour. The specific capacitance was calculated from charge-discharge data and the best value (105 F g(-1) at 1 mA cm(-2)) was obtained for nickel-copper foams deposited at 1.8 A cm(-2) for 180 s. Cycling stability of these foams was also assessed and they present a 90 \% capacitance retention after 10,000 cycles at 10 mA cm(-2). |
| DOI |
http://dx.doi.org/10.1007/s10800-013-0646-y |
| ISBN |
|
| Publisher |
|
| Book Title |
|
| ISSN |
0021-891X |
| EISSN |
1572-8838 |
| Conference Name |
|
| Bibtex ID |
ISI:000332744400004 |
| Observations |
|
